| 摘要 |
PROBLEM TO BE SOLVED: To realize a substrate polishing device and a method, where polishing characteristics such as a polishing rate can be kept independent of an abrasion loss in an abrasive cloth through dressing. SOLUTION: A polishing plate 5, mounted with a polishing cloth 6 where recesses such as grooves and holes are provided on its surface and a work 4 (polished body), is moved relatively with respect to each other to polish the surface of the work 4, where the depths of the recesses of the abrasive cloth 6 corresponding to an abrasion loss in the abrasive cloth are measured by a displacement gauge 16. A polishing pressure corresponding to the depth of a recess is calculated by a polishing pressure calculating device 17 so as to obtain a constant polishing rate, a polishing pressure control 18 gives a polishing pressure to a carrier pressing mechanism 12, and a polishing operation is carried out with a calculated polishing pressure. |
