| 摘要 |
PROBLEM TO BE SOLVED: To make the bonding to a printed board rigid and form a through hole conductor layer with high density by making the coefficient of thermal expansion of an insulating substrate high and approximate to that of a printed board using a glass-epoxy insulating layer. SOLUTION: In this manufacturing method, lithium silicate glass powder containing 5-30 wt.% of lithium oxide (LiO2) whose surface is coated with homopolymer of isobutylmethacrylate, and filler powder containing metal oxide whose coefficient of thermal expansion is at least 6×10-6/ deg.C are added to photosensitive resin composition and dispersed, thereby obtaining a photosensitive green sheet 1. It is irradiated with a light and developed, thereby forming a photo-setting glass ceramic sheet 1a having through holes 3. On the surface of the sheet 1a and in the through holes 3, a conductor layer 4 for wiring and a conductor layer 5 for through holes are formed. Finally, baking is performed, and a wiring conductor layer 6 and a through hole conductor layer 7 are formed on the surface and in the inside of an insulating substrate 1b composed of glass ceramic. |
