发明名称 ADHESIVE LABEL SHEET FOR SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To improve handling of storage, transportation, and supply, and make an adhesive label smoothly peelable by arranging plural adhesive labels to be peelable on a separator, and forming zonal reinforcement parts at both ends of the separator. SOLUTION: On a long-size separator 1, plural adhesive labels A laminated with a label base material and an adhesive layer are successively placed preferably with a space between each other. And, both edges of the separator 1, namely both edge in the width direction, are continuously provided with zonal reinforcement parts B, and these reinforcement parts B are formed straight in parallel with the separator edge parts. It is preferable to provide a space without contact between the reinforcement part (s) B on both edges or either edge and the adhesive labels A because unnecessary adhesive films can be successively removed at the time of manufacturing the sheet, however, the reinforcement parts B on both edges and the adhesive labels can be brought into contact with each other. Therefore, handling of rolled materials and sheet laminated materials is improved, and it is possible to smoothly peel the adhesive labels A off from the separator 1.
申请公布号 JP2000221888(A) 申请公布日期 2000.08.11
申请号 JP19990020971 申请日期 1999.01.29
申请人 NITTO DENKO CORP 发明人 YAMAMOTO MASASHI;TANIGAWA MASAYOSHI;HASEGAWA YOSHIJI;SANO KENJI;ANDO MASAHIKO;OSHIMA TOSHIYUKI
分类号 G09F3/10;B31F5/08;B65D73/00;C09J7/02;(IPC1-7):G09F3/10 主分类号 G09F3/10
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