PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION OF PATTERN AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To obtain a negative type photosensitive resin composition easy to produce, excellent in viscosity stability and image forming property and developable with an alkaline aqueous solution having high safety to the environment by incorporating a specified polyimide and a photo-acid generating agent. SOLUTION: The photosensitive resin composition contains a polyimide of formula I and a photo-acid generating agent. In the formula I, R1 is a tetravalent organic group of formula II, R2 is a divalent organic group and at lest one of R1 and R2 contains one or more groups -OCH2CH=CH2. In the formula II, X stands for a single bond, -O-, -SO2-, -CH2-, -C(CH3)2- or -C(CF3)2-, (m), (n) and (p) are each 0, 1 or 2 and m+n+p>=1. A film formed using the photosensitive resin composition is irradiated with a mask of a prescribed pattern and developed with an alkaline aqueous solution to produce the objective pattern.