发明名称 CASING AIRFLOW STRUCTURE FOR ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To contrive to enhance an airflow property of a casing main body toward the outside by a method wherein a power supply circuit is arranged in the easing main body, and also an integrated drive and the other electric apparatus are away from a chassis to attach the chassis, and there are one or more airflow holes at predetermined positions of a front face panel. SOLUTION: An integrated drive 3 of a CD and a power supply circuit 4 are arranged in sequence on a chassis 1 rearwardly from a front face panel 2, and the power supply circuit 4 and integrated drive 3 are separated by a predetermined distance from the chassis 1 by respective members. In the members in this case, a periphery of the integrated drive 3 is pressed by a screw 9, etc., from left and right by a support plate 8 bent in the integrated drive 3. Furthermore, four airflow holes 17 are opened at an upside of the front face panel 2, and a hot air generated inside the casing main body is released by the airflow hole 17, and also the outer air is taken into the inside.
申请公布号 JP2000223869(A) 申请公布日期 2000.08.11
申请号 JP19990018724 申请日期 1999.01.27
申请人 TOOKADO:KK 发明人 ENDO HIROSHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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