发明名称 WIRING BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board in which a return current route can be ensured even when a slit or an opening is formed in a power-supply layer of a grounding layer and in which unwanted electromagnetic waves can be reduced thoroughly. SOLUTION: A slit 10 is formed along the formation direction of a signal pattern 4 formed at a time when the shape of the signal pattern 4 formed on a signal layer 1 is projected on a grounding layer 3, and it is formed in an opening width (w) which is narrower than the width W of the signal pattern 4.
申请公布号 JP2000223800(A) 申请公布日期 2000.08.11
申请号 JP19990025702 申请日期 1999.02.03
申请人 TOSHIBA CORP 发明人 KO YAKUSHIBA
分类号 H05K9/00;H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K9/00
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