| 摘要 |
PROBLEM TO BE SOLVED: To prevent bonding defects due to the breakage of a bonding tool and to eliminate bonding damages by setting a direction in which an ultrasonic wave vibrates to a direction perpendicular to an electrode. SOLUTION: An ultrasonic vibration system of this bonding apparatus comprises a bonding tool 5, a horn 6, and a piezoelectric element for generating ultrasonic vibrations. This ultrasonic vibration system has an elongated column- shaped configuration extending in a direction perpendicular to a work mounting surface. The tool 5 is designed to vibrate in a direction perpendicular to the work mounting surface, and extends in parallel with the horn 6. A direction in which an ultrasonic wave vibrates, i.e., a direction in which the tool 5 vibrates is along the length of the tool 5, i.e., in a direction perpendicular to the surface of an electrode pad 2. As a result, bonding defects due to the breakage of the tool 5 can be prevented, and bonding damages can be eliminated, and hence the production yield can be remarkably improved.
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