STIFFENER FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a stiffener for a semiconductor device which can be manufactured easily at low cost and provide a method for manufacturing such a stiffener. SOLUTION: A metal plate 2 formed with a through hole 1 is mounted on a pressure die 3 and a metal piece 4 is disposed in the through hole 1. The metal piece 4 is smaller in thickness than the metal plate 2 and has a little bit smaller outer size than the through hole 1. Next, the metal piece 4 is pressurized by a pressure punch 5 to be extended in the direction shown by arrows to abut against an inner wall 6 of the through hole 1. As a result, the metal plate 2 and the metal piece 4 are integrated into one body, forming a recessed section 8 in the metal plate 2 which then becomes a specified stiffener 7 for a semiconductor device.