| 摘要 |
PROBLEM TO BE SOLVED: To dispense with a deburring process so as to curtail the number of manufacturing processes at large, and materialize the reduction of lead time, by cutting a tie bar and resinous burrs with an upper edge which has a specified angle of attack to the direction of lead-out of the lead led out of the package of a resin mold. SOLUTION: A semiconductor chip is mounted on a lead frame, and it is wired. It is molded with resin to form a package 4. The tie bar 5 of the lead frame is press-cut by an upper edge 11 which has a specified angle of attack to the direction of lead-out of the lead 1 led out in substantially horizontal direction from the package 4 and a lower edge 12 which has a substantially horizontal plane. Hereby, the cutting of the tie bar and the curtailment of the resinous burr can be performed without breaking the package 4, and the burr removal process is semiconductor manufacture can be curtailed. Accordingly, the reduction of the lead time can be materialized by achieving the curtailment of the number of processes. Moreover, the dry treatment in semiconductor manufacture process becomes possible. |
