| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has a reliabile semiconductor chip and has a good heat radiating property. SOLUTION: A semiconductor device consists of a semiconductor chip 6 having an electrode on one principal plane (rear surface), a heat sink 1 which, being disposed face to face with the rear surface of the semiconductor chip 6, absorbs heat generated by the semiconductor chip 6, an insulating board (ceramic board) 2 which is disposed between the semiconductor chip 6 and the heat sink 1 and is thermally connected to the heat sink 1, a conductive plate (copper plate) 3 which is disposed between the semiconductor chip 6 and the ceramic board 2, being joined to the ceramic board 2, and a group 9 of metal thin wires which is intertwined metal thin wires 11 having a resiliency. The group 9 of metal thin wires is squeezed to be secured between the semiconductor chip 6 and the copper plate 3. Due to this structure, even if there is a deviation in position in the longitudinal direction or the transverse direction between the semiconductor chip 6 and the copper plate 3, a thermal and electrical connection can be kept without damaging the semiconductor chip 6. |
