| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliability semiconductor device wherein if a PBGA is heated in a moisture absorption state, no peeling occurs at the interface between a semiconductor chip and adhesives. SOLUTION: A die pattern 17 on a circuit board 25 is a full pattern larger than a semiconductor chip 19. Owing to this pattern 17, no voids appear in adhesives 27, absorbed moisture never stagnates near the adhesives 27, and if a PBGA 41 is heated in a moisture absorption state, no peeling occurs at the interface between a semiconductor chip 29 and adhesives 27. |
