| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein the coplanarity of solder balls below a semiconductor chip is good if the balls are disposed below the chip, a stable connection to an external wiring board is obtained and a stress to the connection is relaxed to avoid deteriorating the connection reliability if the solder ball spacing is small. SOLUTION: In a semiconductor device using solder balls 11 as terminals for connecting a board to externals, the solder balls 11 are mounted on solder mounts of a wiring board 5 through an insulation plate 10 made of an electrically insulative material having a high thermal conductivity, the balls 11 are disposed below a semiconductor chip and the coplanarity of the solder balls below a semiconductor chip is good, a stable connection to an external wiring board is obtained and a stress to the connection is relaxed to avoid deteriorating the connection reliability if the solder ball spacing is small. |
