发明名称 CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To facilitate the manufacture and to excellently compensate various different thermal expansions. SOLUTION: The circuit device is equipped with a contact element which is electrically connected to a microstrip 7 of a microstrip line. The contact element has a conductive casing 3 and a ball 4 of conductive yarn or beltlike material in the casing 3. The casing 3 is electrically connected on the microstrip 7 and the clew body 4 presses a waveguide elastically.
申请公布号 JP2000223913(A) 申请公布日期 2000.08.11
申请号 JP20000011896 申请日期 2000.01.20
申请人 ROBERT BOSCH GMBH 发明人 WEIBLEN KURT;LUCAS BERNHARD;SEIZ JUERGEN;KUGLER ANDREAS;DIETERICH ACHIM
分类号 H01P1/30;H01P5/107;H01R13/24;(IPC1-7):H01P5/08 主分类号 H01P1/30
代理机构 代理人
主权项
地址