| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being removed or projecting by providing a protrusion for preventing inclination of the wafer on a stage. SOLUTION: A stage 2 is provided, as a mechanism for positioning a semiconductor wafer carrier 1, with three kinematic pins 3 by a standardization mechanism of semiconductor, i.e., SEMIE 57, and the semiconductor wafer carrier 1 is provided with three kinematic couplings 4 by SEMIE 57. Furthermore, the stage 2 is provided with an anti-inclination protrusions 5 of the semiconductor wafer carrier 1 at three points. Under a state where the semiconductor wafer carrier 1 is positioned normally, the semiconductor wafer carrier 1 is brought into contact with the anti-inclination protrusions 5 such that no load is applied thereto.</p> |
