| 摘要 |
PROBLEM TO BE SOLVED: To realize a TAB tape capable of easily indicating a faulty part, and a method of marking the faulty part of the semiconductor package using the TAB tape, in the manufacture process of the semiconductor package using the TAB tape. SOLUTION: This TAB tape 1 is provided with a lead 5 for making to indicate faulty part, or a TAB tape 1 which is provided with a lead 5 for making to indicate the faulty parts at a position, where it does not hinder mounting of an adhered such as a semiconductor chip and the setup and processing, and a method of marking the faulty part of a semiconductor package which indicates the faulty part by transforming the lead 5 for marking when the faulty part is found in the semiconductor package, in the manufacturing process of the semiconductor package using the TAB tape provided with a lead 5 for making so as to indicate the faulty part.
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