发明名称 CONNECTING STRUCTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To improve heat resistance, simplify a structure, and reduce cost, by interposing a sheet-shaped or foil-shaped soldering material between a lead terminal and an end surface of a component body, and by heating the soldering material to electrically, mechanically mount the lead terminal to the component body. SOLUTION: On both end surfaces of a core 1 of a coil component 10, coil terminals 2a, 2b pulled out from a coil 2 and lead terminals 4a, 4b are respectively electrically interconnected through sheet-shaped soldering materials 8a, 8b previously adhered to the both end surfaces of the core 1, and are mechanically integrally bonded. Therefore, the coil terminals 2a, 2b and lead terminals 4a, 4b can be strongly integrally bonded without requiring a soldering process, and extremely good workability can be provided, and manufacturing cost can be reduced. When the coil component 10 is soldered and mounted to a board, a melting point of the soldering materials 8a, 8b is higher than a soldering temperature, therefore, a connecting portion does not melt, and a heat resistance characteristic of the coil component 10 is improved.
申请公布号 JP2000223169(A) 申请公布日期 2000.08.11
申请号 JP19990021589 申请日期 1999.01.29
申请人 TDK CORP 发明人 KOBAYASHI KAZUMI;KOTANI TSUTOMU
分类号 H01C17/28;H01F5/04;H01G4/228;H01R4/02;H01R43/02;(IPC1-7):H01R4/02 主分类号 H01C17/28
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