| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a plastic sealed semiconductor device which requires no special processing, etc., of a metal mold and can prevent the generation of cracks or openings of a package at the time of cutting tie bars or resin cut without preventing the miniaturization of the package. SOLUTION: Inside a primary mold 3 (3a, 3b) devided into upper and lower parts and a secondary mold 4 (4a, 4b) split into upper and lower parts disposed outside the primary mold 3, semiconductor elements 1A, 1B with lead frames 2A, 2B are disposed. Then, the space between the primary mold 3 and the secondary mold 4 is filled with a resin for resin sealing. The distance between the lower primary mold 3a and the lower secondary mold 4a is larger than that between the upper primary mold 3b and the upper secondary mold 4b. It is preferable that the upper secondary mold 4b and the upper primary mold 3b are formed nearly in the same shape.
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