| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic apparatus in which a heat generating component on a circuit board can be cooled by utilizing cooling air sucked by a fan device and cooling air sent by the fan device and improve the cooling efficiency of the heat generating component. SOLUTION: An electronic apparatus has a housing 4. A circuit board 30 is housed in the housing. The inside of the housing is partitioned by a suction path 36 and an exhaustion path 37 by the circuit board. An MPU(micro procesing unit) 32 which is exposed to either one of the suction path or exhaustion path is mounted on the circuit board. A fan device 43 is housed in the housing. The fan device has a suction inlet 50 linked with the suction path and a blowing outlet 51 linked with the exhaustion path. Cooling air is made to circulate through the suction path and the exhaustion path by driving the fan device.</p> |
