| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a pressure loss of a heat exchanger itself per air amount even when a heat generation part is mounted biasedly to a downstream side of a board by a method wherein a first element is mounted on a substrate, and is disposed at a downstream side of a cooled air. SOLUTION: A CPU as a first element to be highly heated is disposed at a downstream side of a cooled air 6 inside a processor board 1, and also is mounted in proximity to a connector 5. The cooled air is flown into a fin group of a first step for heat-exchange, and part thereof is flown out from a space provided between the first step and second step. Next, the cooled air 6 which is flown into a fin group of a second step is heat-exchanged, and further part of the cooled air 6 is flown out from a space between the fin groups of the second step and a third step, and is flown into the fin group of the third step, and heat at the downstream side is heat-transferred to an upstream side to cool. Thus, a cooling air amount to be supplied can be increased at a maximum.</p> |
