| 摘要 |
PROBLEM TO BE SOLVED: To determine bonding quality simply, without destructing a product by inspecting whether an air layer is present in a bonded interface layer by using an ultrasonic wave. SOLUTION: An ultrasonic wave is allowed to be incident on the surface of a sheet-like second member bonded to a first member 10, and the reflected wave of the incident ultrasonic wave is taken in as an image. The presence of the air layer A present in a bonded interface layer 14 is determined from the waveform pattern of the reflected wave displayed by the image to determine adhesiveness. |
