LEAD FORMING DIE AND METHOD OF FORMING LEAD

摘要

PROBLEM TO BE SOLVED: To prevent peeling off of solder plating on an external lead terminal when forming the external lead terminal. SOLUTION: An IC package 10 is placed on a bending die 20, a Z axis motor 31 is driven to point-contact the tip 30A of a punch is on an external lead terminal 11 of the IC package by controlling by a motor controlling part (not shown), and then the Z axis motor 31 and an X axis motor are simultaneously driven. Thereby, the external lead terminal 11 is simultaneously energized, and it is folded on a projection 21 of the bending die 20 as a. Moreover, by continuing to drive the Z and X axis motors 31, 33 tother, the tip 30A of the punch 30 guides the external lead terminal 11 to the bending die 20 with maintaining point-contact and laying down a trail of sectional shape. Thus, the external lead terminal 11 is finished in a final shape.