发明名称 |
PROCEDE DE REALISATION DE MODULES ELECTRONIQUES A CONNECTEUR A BILLES OU A PREFORMES INTEGRE BRASABLES SUR CIRCUIT IMPRIME ET DISPOSITIF DE MISE EN OEUVRE |
摘要 |
The invention concerns a method for producing electronic modules with ball connector (7) or integrated preforms capable of being soldered on a printed circuit (3) and a device for implementing said method. The invention concerns a method for producing electronic modules in the form of ball housings combining a ball grid array (7) or geometrically identical preforms for interconnecting or shielding and surface-mounted components (2) on the same surface of a substrate (1), thereby enabling said module to be directly connectable by soldering on a printed circuit (3). The balls (7) and the components (2) are transferred in one single step onto the substrate (1) by means of a gripping device adapted to the topography of the module to be produced. |
申请公布号 |
FR2789541(A1) |
申请公布日期 |
2000.08.11 |
申请号 |
FR19990001390 |
申请日期 |
1999.02.05 |
申请人 |
SOCIETE NOVATEC SA |
发明人 |
BOURRIERES FRANCIS;KAISER CLEMENT |
分类号 |
G06K19/077;H05K1/00;H05K1/14;H05K3/34;H05K3/36 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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