发明名称 SOLDERING STRUCTURE OF ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve the reliability of the attachment of a high frequency unit of which an electronic apparatus is composed. SOLUTION: An electronic apparatus has a mother printed board 11 on which electronic components are mounted, a frame 19 to which the mother printed board 11 is attached, a plurality of legs 20 provided on the lower part of the frame 19 and pairs of protrusions 21 formed on the respective tips of the legs 20. Through-holes 22 into which the protrusions 21 are inserted are formed in the mother printed board 11. With this constitution, the reliability of the attachment of a high frequency unit 12 of which the electronic apparatus is composed can be improved.
申请公布号 JP2000223861(A) 申请公布日期 2000.08.11
申请号 JP19990023545 申请日期 1999.02.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKADA HIRONOBU
分类号 H05K1/18;H05K7/12;(IPC1-7):H05K7/12 主分类号 H05K1/18
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