| 摘要 |
PROBLEM TO BE SOLVED: To obtain the wiring board which can tightly be joined to a substrate of a protection glass, a resistance body, a Cu plating layer, and a wiring conductor for a ceramic insulating substrate and suitable to a hybrid integrated circuit board equipped with a reliable thick-film resistance body layer. SOLUTION: On the wiring conductor formed principally of tungsten (W) or molybdenum (Mo) while adhered to the surface of an insulating substrate 1 made of a ceramic sinter, the Cu plating layer 5 is formed and on the Cu plating layer 5, the thick-film resistance body 6 is formed; and the thick-film resistance body 6 is covered with protection glass 7 made of borosilicate glass containing Ca by 5 to 15 wt.% of oxide.
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