| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the problem regarding a microprobe device, such as the crosstalk, impedance mismatching, unnecessary signal delay, etc., by providing conductive plate springs having sizes equivalent to those of the electrode pads of an LSI chip to be tested as microprobes at the corresponding positions on an SOI(silicon on insulator) substrate at which the microprobes are faced oppositely to the electrode pads of the LSI chip by the number of the electrode pads. SOLUTION: Microporbes 1 are arranged on the bottom side of an SOI substrate 4 at matching positions at which the microprobes 1 are faced oppositely to the electrode pads 6 of an LSI chip 5 so that the microprobes 1 may come into contact with their corresponding electrode pads 6 when the SOI substrate 4 is faced to the LSI chip 5 in parallel. The microprobes 1 are constituted of metallic plate springs and elastically come into contact with the electrode pads 6. It is preferable, therefore, to use a metal, such as platinum, rhodium, their alloys, etc., having a low electrical resistance for forming the microprobes 1 and the size of the microprobe 1 varies depending upon the size or pitch of the electrode pads 6. At the intermediate projecting end sections 1c of the microprobes 1 which come into contact with the electrode pads 6, pyramid-shaped small projections 3 are formed for obtaining stable electrical contact.
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