| 摘要 |
PROBLEM TO BE SOLVED: To make temperature control executable at every semiconductor device formed on a substrate by housing the semiconductor devices in a plurality of sockets and controlling the heating values of heaters provided at every socket. SOLUTION: A plurality of sockets 2 is soldered to the upper surface of a substrate 1 and a plurality of passive parts 3 is soldered to the rear surface of the substrate 1. In each socket 2, a semiconductor device placing section 2b on which a semiconductor device 5 can be placed and a lid section 2a are formed. The passive parts 3 are protected with a protective cover 7. The sockets 2 and passive parts 3 are connected to an edge connector 4 through patterned wiring and the connector 4 is connected to a signal supplying means. In addition, the semiconductor device placing section 2b of each socket 2 is provided with a heater 6 having a temperature adjusting function for heating the semiconductor device 5. Therefore, the fluctuation of a burn-in temperature due to the heat generated from the semiconductor devices 5 can be eliminated.
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