| 摘要 |
PROBLEM TO BE SOLVED: To make a cutting operation easy when cutting guide pins for positioning which project from a resin case in line with pin terminals as requested by a user and prevent an unexpected bending of the guide pins during transportation, etc. SOLUTION: A semiconductor device is provided, on an upper face of a resin case 1, with guide pins 4 for positioning in line with pin terminals 3 for a control signal to be connected to a connector on a printed wiring board on which the semiconductor device is to be mounted. The guide pins 4 are inserted as strong metal pins into the resin case. The length of each guide pin 4 is specified to a standard size L0 and each pin is preliminarily formed in a middle part with a constricted part 4a of a smaller diameter than that of the pin itself to be used when the pin is cut short. When there is a demand for a change in specifications to cut the guide pins 4 short, the guide pins 4 are cut at the constricted part 4a to remove an end part.
|
