发明名称 CHIP COMPONENT AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To reduce the manufacturing cost of chip resistors by eliminating the need for using expensive silver (Ag). SOLUTION: This chip resistor includes a chip block 10, an electrode portion 20 provided with an upper electrode 22, which is formed on top face and both end faces of the chip block, and an end face 24, an electrical characteristic layer 30 of the resistor, which is printed on the top face of the chip block 10 so as to enable connection to the top electrode 22, a protective layer 40 formed on the electrical characteristic layer 30, a terminal electrode 50 formed in upper side of the electrode portion 20 for mounting on a substrate. The top electrode 22 is constituted such that it must have a terminal connection portion S connected directly to the terminal electrode 50 to enable complete bypass of electrical signals through the terminal electrode 50. Due to this construction, the resistance characteristic are stabilized without using silver (Ag) for the electrode portion excluding the top electrode to decrease the self- resistance, further reducing the manufacturing costs.</p>
申请公布号 JP2000223301(A) 申请公布日期 2000.08.11
申请号 JP19990325449 申请日期 1999.11.16
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 GO JUNKI
分类号 H01C17/06;H01C1/01;H01C1/14;H01C1/142;H01C1/148;H01C7/00;H01C7/18;H01C17/00;H01L21/02;(IPC1-7):H01C7/00 主分类号 H01C17/06
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