发明名称 APPARATUS AND METHOD FOR COMPRESSION MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a compression molding apparatus and compression molding method, capable of readily manufacturing in a short time a molded body with high quality and high dimensional accuracy. SOLUTION: A compression molding apparatus 1 is a compression molding apparatus for compressing and molding a bonded magnet, and comprises an outer die 2 for compression and molding, and an upper punch 7 and a lower punch 8 for compressing a molding material 15 filled in the outer die 2. The outer die 2 is constituted along the axial direction by a heat part 3 for heating the molding material 15, a cooling part 5 for cooling the molding material 15, and a heat insulating part 4 positioned therebetween. The upper punch 7 and lower punch 8 can axially move within a molding space 21 relative to the outer die 2, respectively. A gap part 73 is formed in an outer periphery of a part, excluding the vicinity of a pressing face 71 of the upper punch 7, and a gap part 83 is formed in an outer periphery of a part, excluding the vicinity of a pressing face 81 for the lower punch 8. These gap parts 73, 83 exhibit heat insulating effects.
申请公布号 JP2000223338(A) 申请公布日期 2000.08.11
申请号 JP19990027313 申请日期 1999.02.04
申请人 SEIKO EPSON CORP 发明人 YAMAGAMI TOSHIAKI;SHIOBARA KIYOSHI
分类号 B22F3/02;B22F3/035;B29C43/02;B29K103/04;B30B11/02;H01F41/02;(IPC1-7):H01F41/02 主分类号 B22F3/02
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