| 摘要 |
PROBLEM TO BE SOLVED: To provide the connection structure with connection reliability for a circuit member which is used for electric connections of a high-density substrate, a semiconductor chip, and various packages including a printed board, a substrate for an integrated circuit, a liquid crystal display plate, and substrate for a semiconductor package. SOLUTION: A semiconductor chip and a semiconductor mounting substrate having connection terminals are counterposed, an adhesive containing conductive particles is interposed between the connection terminals, and heat or pressure is applied to electrically connect the 1st connection terminal and 2nd connection terminal which are counterposed. In this case, >=1 recessed part is formed on the top surfaces of the connection terminals and the steps of the recessed parts are 30 to 100% of the mean particle size of the conductive particles.
|
