| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric double layer capacitor of a structure, wherein a crack in a molding resin packaging under high-temperature environment such as the condition of a solder reflow can be easily prevented from being generated. SOLUTION: A holding member 5, which is held to an element laminate material 3 and the outer side of a pair of lead integral type electrode plates 1 and 2, in a state that an insulation between the electrode plates 1 and 2 is maintained and is used for pressure-holding the laminated material 3 and the electrode plates 1 and 2 in the laminating direction of the laminated material 3 and the electrode plates 1 and 2, shows a continuous ring shape without joints and is held to the element laminate material 3 and the electrode plates 1 and 2, in such a way as to encircle the materiel 3 and the plates 1 and 2. |
