发明名称 COMPONENT MOUNTING METHOD AND APPARATUS
摘要 The component handling tool (14) is moved linearly up and down on a moving mechanism (11) by feedback control of a linear motor (16) for performing pickup and mounting actions of components (3). The linear motor is controlled to effect a downward movement of the component handling tool for bringing the component handling tool or the component held thereby closer to the component or to a mounting object, and upon detecting changes in control information when contact is made with the component or the mounting object, control of the linear motor is switched to a pressing operation, whereby the holding or mounting of the component in a prescribed pressed condition is accomplished.
申请公布号 WO0025564(A3) 申请公布日期 2000.08.10
申请号 WO1999JP05893 申请日期 1999.10.25
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;NAKAO, OSAMU;YOSHIDA, NORIAKI;TAKEDA, TAKESHI 发明人 NAKAO, OSAMU;YOSHIDA, NORIAKI;TAKEDA, TAKESHI
分类号 H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K13/04
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