| 摘要 |
<p>A package (100) includes a substrate mechanically supporting circuitry. A conductive cover (130) (e.g., a metal sheet) is over the circuitry so that the circuitry is exposed below an opening (132) in the conductive cover. A bent down corner (134) of the conductive cover is inserted into a hole in the substrate. A solder ball is placed on the other end of the hole. During a subsequent heating, the solder ball is drawn up through the hole. When cooled, the conductive material grasps onto the tip of the bent down corner, thereby establishing a good connection between the conductive cover and the newly formed conductive via. As a finger (101) approaches the circuitry (e.g., a fingerprint detection circuit), the finger first discharges electrostatic charge into the cover, not into the circuit, thereby protecting the circuit. In another package, the cover is composed of a highly resistive material, to slowly dissipate the electrostatic charge. Thus, the induced parasitic currents in the circuit are relatively low and damage to the circuit is avoided.</p> |
