| 摘要 |
<p>The present invention relates to arrangements for reducing crosstalk between conductors on a conductor carrier, and also to methods for manufacturing conductor carriers that include said arrangements. Crosstalk between the conductors is prevented by providing a high capacitance in the space between each conductor and the earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductor and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index εr than the other dielectric material.</p> |
