| 发明名称 |
Electroless gold plating solution and process |
| 摘要 |
<p>Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates.</p> |
| 申请公布号 |
EP1026285(A2) |
申请公布日期 |
2000.08.09 |
| 申请号 |
EP20000300548 |
申请日期 |
2000.01.26 |
| 申请人 |
SHIPLEY COMPANY LLC |
发明人 |
TOBEN, MICHAEL P.;MARTIN, JAMES L.;OHTA, YASUO;TAKIZAWA, YASUSHI;ENOMOTO, HARUKI |
| 分类号 |
H05K3/18;C23C18/16;C23C18/44;H05K3/24;(IPC1-7):C23C18/44 |
主分类号 |
H05K3/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
