发明名称 Apparatus and methods of substrate polishing
摘要 <p>A substrate polishing scheme (apparatus and method) (10) is described according to which a polishing surface (16) of a polishing sheet (14) is driven in a generally linear direction by a drive mechanism (18) surface of a substrate (32) is held against the polishing surface of the polishing sheet by a polishing head (12), and the substrate is probed through the polishing sheet by a monitoring system (22). <IMAGE></p>
申请公布号 EP1025954(A2) 申请公布日期 2000.08.09
申请号 EP20000300783 申请日期 2000.02.01
申请人 APPLIED MATERIALS, INC. 发明人 REDEKER, FRED C.;BIRANG, MANOOCHER;LI, SHIJIAN;SOMEKH, SASSON
分类号 B24B21/04;B24B21/18;B24B37/005;B24B49/04;B24B49/12;H01L21/304;H01L21/306;H01L21/66;(IPC1-7):B24B37/04 主分类号 B24B21/04
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