发明名称 |
Apparatus and methods of substrate polishing |
摘要 |
<p>A substrate polishing scheme (apparatus and method) (10) is described according to which a polishing surface (16) of a polishing sheet (14) is driven in a generally linear direction by a drive mechanism (18) surface of a substrate (32) is held against the polishing surface of the polishing sheet by a polishing head (12), and the substrate is probed through the polishing sheet by a monitoring system (22). <IMAGE></p> |
申请公布号 |
EP1025954(A2) |
申请公布日期 |
2000.08.09 |
申请号 |
EP20000300783 |
申请日期 |
2000.02.01 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
REDEKER, FRED C.;BIRANG, MANOOCHER;LI, SHIJIAN;SOMEKH, SASSON |
分类号 |
B24B21/04;B24B21/18;B24B37/005;B24B49/04;B24B49/12;H01L21/304;H01L21/306;H01L21/66;(IPC1-7):B24B37/04 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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