发明名称 |
INTEGRATED ELECTRONIC CIRCUIT COMPRISING AT LEAST AN ELECTRONIC POWER COMPONENT |
摘要 |
A method of producing an integrated circuit having a plurality of electronic components by the steps of:a) forming plurality of components with connection points in a substrate plate;b) forming a connection support of conducting tracks;c) transferring the substrate plate onto the connection support connecting the connection points with the conducting tracks;d) forming at least one separation trench in the substrate plate, surrounding a portion of substrate having at least one electronic component, in a way that separates it from the other components in the plate; ande) filling the trenches with a dielectric material. |
申请公布号 |
EP1025584(A1) |
申请公布日期 |
2000.08.09 |
申请号 |
EP19990939494 |
申请日期 |
1999.08.24 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
GIDON, PIERRE |
分类号 |
H01L21/76;H01L21/301;H01L21/56;H01L21/60;H01L21/764;H01L21/822;H01L21/8222;H01L21/8248;H01L21/8249;H01L23/051;H01L23/14;H01L25/04;H01L25/18;H01L27/04;H01L27/06;(IPC1-7):H01L23/14;H01L21/784 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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