发明名称 METAL ON PLASTIC FILMS WITH ADHESION-PROMOTING LAYER
摘要 <p>The adhesion to plastic substrates of thick layers of functional metals having an oxide heat of formation that is greater than -40,000 calories/gram atom of metal, such as silver, copper, gold, and the like, is improved if a thin layer of a metal having an oxide heat of formation of less than -50,000 calories/gram atom of metal is present as an adhesion-promoting primer layer. When the primer layer metal has a melting point greater than 1100 DEG C., it should be present as the metal or as a substoichiometric oxide. When the primer layer metal has a melting point less than 1100 DEG C., it may be present as the metal, as a substoichiometric oxide, or as a full stoichiometric oxide. Processes for preparing these materials using sputter-depositing and reflectors incorporating these materials are also disclosed.</p>
申请公布号 EP0686093(B1) 申请公布日期 2000.08.09
申请号 EP19940908723 申请日期 1994.02.04
申请人 SOUTHWALL TECHNOLOGIES, INC. 发明人 GIBBONS, KEVIN, P.;LAU, LOUIS, C.;WOODARD, FLOYD, E.
分类号 B32B15/09;C23C14/02;C23C14/08;C23C14/20;C23C14/34;C23C28/00;H05K1/03;H05K3/38;(IPC1-7):B32B31/00;B32B33/00 主分类号 B32B15/09
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