发明名称 |
Power conversion system having multi-chip packages |
摘要 |
A power conversion system that is capable of achieving low inductance, improving cooling performance and making the external shape of the entire system small, is achieved by combining a plurality of single phase inverter units. The inverter units include four device packages each of which is composed of four packaged power devices, two neutral point clamp diodes, two by-pass diode packages and clamp diode packages. Each by-pass diode packages is composed of two packaged by-pass diodes. The clamp diode packages are composed of packaged clamp diodes. The by-pass diode packages are provided on one of the wall surfaces of the clamp diode package, and the device packages are provided on an outside wall surface of the by-pass diode package.
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申请公布号 |
US6101114(A) |
申请公布日期 |
2000.08.08 |
申请号 |
US19990350912 |
申请日期 |
1999.07.12 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KIJIMA, KENJI;OMURA, ICHIRO;SAITO, SUZUO |
分类号 |
H02M1/06;H02M7/00;H02M7/06;H02M7/483;H02M7/5387;(IPC1-7):H02M7/538;H02M7/68 |
主分类号 |
H02M1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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