| 摘要 |
PROBLEM TO BE SOLVED: To uniformly batch perforate many discharge nozzles of good quality in a short time at a thick orifice plate. SOLUTION: A wafer 29 of an ink jet head board is placed on a jig 36 of a treating chamber 35 of a helicon wave etching unit, and mechanically or electrostatically fixed. An RF(radio frequency) bias is applied from a bias power source 38 to the wafer 29 through a support base 37 and the jig 36 and cooled to '-10 deg.C' or below by using a refrigerant by a low temperature circulator 39. A treating oxygen gas supplied from a pipeline 46 to a source flow chamber 42 is produced with a plasma by a high frequency voltage applied from a source flow power source 47 to a antenna 43, fed to the chamber 35 by an inner coil 44 and an outer coil 45, uniformly confined in the chamber 35 by a magnet 41, attracted and accelerated by a potential of the wafer 29 of an RF bias voltage to etch an orifice plate on the wafer 29. A temperature of an adhesive material 3a is suppressed to a Tg or below.
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