METHOD FOR ELECTRICAL INTERCONNECTION AND CHARGE PLATE

摘要

PROBLEM TO BE SOLVED: To provide a method for high-density electrical interconnection between a driver chip and charging electrodes controlled by the chip. SOLUTION: The method for establishing a high-density electrical interconnection between high-voltage driver chips and charging electrodes controlled by the chips is provided. The charge plate has a charging electrode density on its face, and an associated mating circuit. Alignment structure is then provided on the charge plate and/or the mating circuit. The alignment structure of the charge late and the mating circuit are mechanically engaged to ensure alignment of a mating contact pads. An interconnect is provided for the aligned mating contact pads.