发明名称 Wafer aligning apparatus for semiconductor device fabrication
摘要 A wafer aligning apparatus for semiconductor device fabrication includes a cassette support on which is mounted a cassette holding wafers immersed in a non-conducting fluid. A guide roller is composed of carbon fiber reinforced polyether and rotates in contact with circumferential edges of the wafers. A wafer support holds the wafers apart from the roller when flat zones of the wafers are aligned with the wafer support
申请公布号 US6099242(A) 申请公布日期 2000.08.08
申请号 US19980130512 申请日期 1998.08.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, HYUNG-SIK;AN, SUNG-SOO
分类号 H01L21/68;(IPC1-7):B65G65/00 主分类号 H01L21/68
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