发明名称 FORMATION OF COATING FILM AND COATING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a coating film forming method and a coating system capable of speedily eliminating the nonuniformity of the thickness of the coating film in the case of generating a prescribed non-uniformity of thickness of the coating film. SOLUTION: When the coating film is formed by supplying a coating liquid on a substrate, the film thickness distribution of the coating film is measured and, when the film thickness distribution is exhibited by a W-type distribution curve in terms of its cross section, the film thickness distribution is adjusted to become a round-type in the cross section in the coating after that by reducing the discharging time of the coating liquid while keeping the discharging quantity of the coating liquid from a coating liquid supply nozzle almost constant and, in the coating after that, the rotation speed of the substrate at the time of discharging the coating liquid is decreased to adjust the film thickness in the outer peripheral part of the substrate to be thick and the coating film is formed on the substrate by using the condition grasped by the adjustment of the film thickness.
申请公布号 JP2000218219(A) 申请公布日期 2000.08.08
申请号 JP19990024981 申请日期 1999.02.02
申请人 TOKYO ELECTRON LTD 发明人 YOSHIHARA KOSUKE
分类号 H01L21/027;B05C5/00;B05C11/08;B05D1/40;G03F7/16 主分类号 H01L21/027
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