发明名称 |
Process for bonding metallic members using localized rapid heating |
摘要 |
The present invention relates to a process for joining two metal members together. The process comprises the steps of providing two parent metal members to be joined and a prealloyed interlayer foil having a melting point depressant; creating a joint interface by positioning the foil between two spaced apart surfaces of the two parent metal members to be joined together; applying a load substantially transverse to the joint interface which does not cause deformation of the surfaces; and applying localized rapid heating in the area of the joint interface at a temperature sufficient to effect bonding of the two metallic members while causing little or no degradation of microstructural or mechanical properties of the parent metal and a coarsening of grain size in rim portions of the metal members.
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申请公布号 |
US6098871(A) |
申请公布日期 |
2000.08.08 |
申请号 |
US19970903230 |
申请日期 |
1997.07.22 |
申请人 |
UNITED TECHNOLOGIES CORPORATION |
发明人 |
CAIRO, RONALD R.;ROBERTSON, JOHN M.;BARONE, J. CARTER;STEWART, DENNIS C. |
分类号 |
B23P11/00;B23K11/16;B23K13/01;B23K20/00;B23K20/02;B23K20/16;(IPC1-7):B23K20/02;B23K31/12 |
主分类号 |
B23P11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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