发明名称 |
Method for forming a pillar CMOS structure |
摘要 |
A method of forming a pillar CMOS FET device, especially an inverter, and the device so formed is provided. The method includes forming abutting N wells and P wells in a silicon substrate and then forming N+ and P+ diffusions in the P and N wells respectively. A unitary pillar of the epitaxial silicon is grown on the substrate having a base at the substrate overlying both the N and P wells and preferably extending at least from said N+ diffusion to said P+ diffusion in said substrate. The pillar terminates at a distal end. An N well is formed on the side of the pillar overlying the N well in the substrate and a P well is formed on the side of the distal end of the pillar overlying the P well on the substrate and abuts the N well in the pillar. A P+ diffusion is formed in the N well in the pillar adjacent the distal end and a N+ diffusion is formed in the P well in the pillar adjacent the distal end. A gate insulator dioxide is formed over both sides of the pillar and gate electrodes are formed over the gate insulators.
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申请公布号 |
US6100123(A) |
申请公布日期 |
2000.08.08 |
申请号 |
US19980009456 |
申请日期 |
1998.01.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRACCHITTA, JOHN A.;MANDELMAN, JACK A.;PARKE, STEPHEN A.;WORDEMAN, MATTHEW R. |
分类号 |
H01L21/8238;H01L27/092;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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