发明名称 Method for forming a pillar CMOS structure
摘要 A method of forming a pillar CMOS FET device, especially an inverter, and the device so formed is provided. The method includes forming abutting N wells and P wells in a silicon substrate and then forming N+ and P+ diffusions in the P and N wells respectively. A unitary pillar of the epitaxial silicon is grown on the substrate having a base at the substrate overlying both the N and P wells and preferably extending at least from said N+ diffusion to said P+ diffusion in said substrate. The pillar terminates at a distal end. An N well is formed on the side of the pillar overlying the N well in the substrate and a P well is formed on the side of the distal end of the pillar overlying the P well on the substrate and abuts the N well in the pillar. A P+ diffusion is formed in the N well in the pillar adjacent the distal end and a N+ diffusion is formed in the P well in the pillar adjacent the distal end. A gate insulator dioxide is formed over both sides of the pillar and gate electrodes are formed over the gate insulators.
申请公布号 US6100123(A) 申请公布日期 2000.08.08
申请号 US19980009456 申请日期 1998.01.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BRACCHITTA, JOHN A.;MANDELMAN, JACK A.;PARKE, STEPHEN A.;WORDEMAN, MATTHEW R.
分类号 H01L21/8238;H01L27/092;(IPC1-7):H01L21/823 主分类号 H01L21/8238
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