| 摘要 |
PROBLEM TO BE SOLVED: To carry out simultaneous correction polishing of upper and lower surface plates by providing a surface correction carrier for double-surface polishing with a hole on one surface of the carrier and a hole on the other surface thereof which have different areas from each other, and a hole communicating with the hole. SOLUTION: This carrier 1 has a gear 1g at its circumference and is in a disc shape. On a carrier center 1c, at one surface, e.g. at an upper surface 2, an upper surface hole 2p is formed while at the other surface, e.g. at a lower surface, a lower surface hole 3p having a different area from that of the former is formed. A stepped part 1d is formed between both hole parts 2p, 3p to cummunicates them with each other. To correct the shape of upper and lower surface plates, for example, the carrier 1 is removed from a double-surface polishing apparatus, the carrier 1 is pressure held between the upper and lower surface plates with the upper surface 2 thereof turned upside, and the gear 1g is meshed with a sun gear and an internal gear. Then, the carrier 1 is press held and is rotated at a specified rotational frequency while a polishing material is fed, and the upper and lower surface plates brought into press contact with the carrier 1 are polished flat. |
