PHOTOCURABLE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photocurable resin composition which exerts an excellent resistance to moist heat and an adhesion strength which is durable against temperature changes and therefore is more useful than conventional adhesives for attaching a CCD lid and a CCD chip made of a transparent thermoplastic resin. SOLUTION: The titled composition contains (A) a urethane (meth)acrylate obtained by allowing a polyol compound to react with a polyisocyanate compound and a hydroxy group-containing (meth)acrylate compound, (B) a (meth) acrylate compound other than the above-mentioned component (A) having at least one (meth)acryloyl group within a molecule, (C) a photopolymerization initiator and (D) a polyol compound.