METHOD FOR MANUFACTURING MICRO INERTIAL SENSOR

摘要

PURPOSE: A method for manufacturing a micro inertial sensor is provided to improve reliability and capability by processing a thick silicon joined to a glass in a high section ratio so that a measured surface and thickness becomes large, to eliminate parasitic capacitance generally caused by a silicon substrate by using glass as a substrate instead of silicon, and to reduce a manufacturing cost by a simple process using a mask. CONSTITUTION: A method for manufacturing a micro inertial sensor comprises the steps of: bonding a bulk silicon on a glass substrate; polishing the bonded bulk silicon to a desired thickness; forming an inertial sensor structure by etching the polished bulk silicon by an anisotropic etching method; forming a vacuum space by etching glass of a bottom portion of the silicon inertial sensor structure; and evaporating metal for an electrode on the entire surface of the etched chips.