| 摘要 |
PURPOSE: A semiconductor memory test socket is provided to use restrained space efficiently by mounting more memory modules on a main board with the narrower gaps between the memory modules. CONSTITUTION: Longitudinal terminals(20, 21) are formed on both outer sides of a socket(10). The terminals(20, 21) are consecutively installed on a main board. Memory modules(M1, M2) are mounted between adjacent sockets(10, 10A, 10B) to be connected to facing terminals(22, 20, 21, 23). The memory modules(M1, M2) are arranged in front and back of the socket(10). Terminal mounting units are longitudinally formed on both outer sides of the socket. Elastic members(30, 31, 30a, 31a) are inserted on the lower and upper sides of a terminal mounting unit to support a terminal. |
