| 摘要 |
PURPOSE: A method for stacking semiconductor packages is provided to improve productivity by electrical connection of leads, i.e., external signal terminals of a stacked semiconductor package. CONSTITUTION: A method for stacking semiconductor packages comprises the steps of: stacking semiconductor packages(101, 102) having a plurality of external leads(101a, 102a) on the side of the packages, by using adhesive; winding a plurality of conductive wire(103) around the body of the stacked semiconductor package(100) at regular pitches, so that the external leads corresponding to each other between the packages are electrically connected by using an automatic wiring apparatus; performing a reflow to have the wire firmly adhered to the respective leads; and cutting and eliminating a part of the wire so that the leads can be isolated from adjacent leads and opposite leads.
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